Pin grid array
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The pin grid array or PGA is a type of packaging used for integrated circuits, particularly microprocessors.
[edit] PGA
On a PGA, the integrated circuit (IC) is mounted in a ceramic slab of which one face is covered, or partially covered, in a square array of metal pins. The pins can then be inserted into the holes rapidly in a printed circuit board and soldered in place. They are almost always spaced 2.54 mm (a tenth of an inch) apart. For a given number of pins, this type of package occupies less space than older types such as the dual in-line package (DIP).
[edit] PGA Variants
The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA) versions were both created by Intel Corporation for their Pentium processors, and are often used on motherboards with ZIF (Zero Insertion Force) sockets to protect the delicate pins.
- PPGA: Plastic pin grid array
- FCPGA: flip-chip pin grid array
- CPGA: Ceramic pin grid array
- OPGA: Organic pin grid array
[edit] See also
- Dual in-line package (DIP)
- Single in-line package (SIP)
- Zig-zag in-line package (ZIP)
- Ball grid array (BGA)
- Land grid array (LGA)
- Centered square number
